High-speed 2D/3D Laser Profiler
LJ-V7000 series
Applications High-speed 2D/3D Laser Profiler LJ-V7000 series
2D Measurement
Height and step difference
Pin height and step height measurement
Width and position
Building material board positioning
Profile and cross section
Sealant inspection
Warpage and flatness
Warpage measurement of PCBs
Angle and radius
Angle measurement of processed products
Thickness measurement
Case thickness measurement
3D Measurement (Image Processing)
Soldering bridge and volume inspection
- Traditional cameras
Inspection is difficult due to influence from PCB patterns and solder surface conditions - LJ-V + Image processing
Inspections including solder presence, bridging, and volume can be performed
Tailored blank welding appearance inspection
- Traditional cameras
Inspection using the camera is difficult because the surface conditions of the workpiece are not stable - LJ-V + Image processing
Stable inspection is possible regardless of the workpiece surface
Card number character recognition (OCR)
- Traditional cameras
Detection is difficult due to influence from the background - LJ-V + Image processing
Reliable character recognition (OCR) is possible no matter what kind of card is being used